How Thermal Management Differs Between Wearable Phototherapy Devices and Full-Body LED Panels

Updated: July 24, 2026 | 13-minute read

Low-power wearable phototherapy devices and high-output full-body panels solve the same basic problem: heat generated inside the LED package must be moved away quickly enough to keep the LEDs, enclosure, power electronics, and user-contact surfaces within their specified limits.

The two categories often use different solutions. Wearables commonly rely on passive heat spreading through copper traces, flexible printed circuit boards, encapsulants, and the outer housing. Large, compact panels often combine metal heat-spreading structures with ventilation and fans. These are common design patterns rather than universal rules. The correct cooling architecture depends on measured input power, optical output, heat flux, enclosure area, ambient conditions, duty cycle, allowable surface temperature, and the complete junction-to-ambient thermal resistance.

Higher junction temperature generally reduces instantaneous radiant output and accelerates long-term degradation, but there is no universal rule that every 10°C increase cuts LED life in half. The actual relationship is specific to the LED material, package, drive current, failure mechanism, and operating temperature. Reliable lifetime estimates require component-specific aging data under defined temperature and current conditions.

This article explains how to compare the thermal architecture of wearables and panels without confusing nominal LED wattage with actual electrical consumption, visible-light lumen maintenance with near-infrared radiant output, or product certification with proof of every thermal design detail.

The physics of heat in LED phototherapy

Cross-section heat flow diagram wearable LED mask versus full-body panel

Conceptual illustration only. Actual substrate, heat-sink, and airflow construction varies by model.

The LED junction is the semiconductor region where electrical energy is converted into optical radiation. Because conversion is not 100% efficient, part of the input energy becomes heat. For a complete device, a useful first-order energy balance is:

Heat generated inside the device ≈ measured electrical input power − optical power leaving the device

This is why the nominal rating printed on an LED package cannot be used as the device's thermal load. For example, an array described as "600 × 5W LEDs" has 3,000W of nominal LED capacity, but the completed product may drive those LEDs well below their package maximum and consume substantially less electrical power.

The junction temperature can be represented conceptually as:

Tj ≈ Ta + Pheat × RθJA

where:

• Tj is LED junction temperature;
• Ta is ambient temperature;
• Pheat is the heat that must be dissipated;
• RθJA is the effective junction-to-ambient thermal resistance of the complete thermal path.

The thermal path may include the LED package, solder joint, PCB or metal-core PCB, thermal interface material, chassis, heat sink, and surrounding air. Thermal resistance is design-specific and changes with assembly quality, orientation, airflow, surface condition, and operating environment.

Three heat-transfer mechanisms are relevant:

1. Conduction moves heat through solids such as copper, aluminum, solder, PCB materials, and the enclosure.
2. Convection transfers heat from a surface to surrounding air. It may be natural or fan-assisted.
3. Thermal radiation transfers energy from the device surface to its surroundings. Its contribution depends on surface temperature, emissivity, and the temperature of nearby surfaces.

Active cooling adds forced airflow or, less commonly, another powered cooling mechanism. It can lower heat-sink-to-air thermal resistance, but the improvement is not a fixed "order of magnitude"; it depends on fan flow, pressure, ducting, fin geometry, obstruction, and system layout.

Temperature affects output in two different ways

The article must distinguish short-term thermal behavior from long-term aging:

• Short-term thermal droop: As the LED reaches steady operating temperature, radiant output may decline and the peak or centroid wavelength may shift slightly. Much of this behavior can reverse after cooling.
• Long-term degradation: Repeated or sustained thermal stress can accelerate irreversible changes in the LED package, solder joints, optics, driver components, and other materials.

The magnitude and direction of wavelength shift are not universal. They depend on semiconductor chemistry, wavelength, current, package, and temperature. A product should therefore be evaluated using cold-start and thermally stabilized spectral measurements rather than a generic wavelength-shift claim.

For 850 nm and other near-infrared channels, use terms such as radiant flux maintenance, optical power maintenance, and irradiance maintenance. Lumen and L70 are visible-light metrics weighted to human vision and are not suitable as the primary performance measures for an invisible 850 nm source.

Thermal safety and photobiological safety are separate assessments

IEC 62471 evaluates photobiological hazards from optical radiation. It defines exposure limits, measurement methods, and risk-group classification for non-laser sources from 200 nm to 3,000 nm. It does not, by itself, certify enclosure temperature, heat-sink adequacy, LED lifetime, or therapeutic dose stability.

Electrical and thermal product safety must be evaluated under the standard that matches the device's intended use and regulatory classification. Depending on the product and market, this may include IEC 60335-2-27 for household and similar appliances exposing skin to optical radiation, IEC 60601-2-57 for medical electrical light-source equipment, or another applicable product standard. IEC 60598-1 is a luminaire standard and should not be applied automatically merely because a device contains LEDs.

How wearable devices manage heat

Labeled heat conduction paths through flexible LED mask substrate and housing

Conceptual illustration only. Actual air gaps and skin-contact conditions depend on product geometry and fit.

Wearables generally operate at lower measured input power than full-body panels, and their LEDs are distributed over a curved or flexible surface. This often makes passive cooling practical, provided that LED spacing, current, copper area, encapsulation, housing material, and session duration are designed together.

A typical passive thermal path may be:

1. Heat leaves each LED package through its thermal pad and solder joint.
2. Copper traces or copper pours distribute heat through a flexible or rigid PCB.
3. The housing and encapsulant spread heat over a larger surface.
4. Heat leaves through the outer surface by natural convection and thermal radiation.
5. Where the device touches or approaches skin, some heat can also transfer toward the body.

The exact balance varies. A face mask may have local air gaps caused by facial contours, spacers, lenses, or the shape of the silicone shell. It is therefore inaccurate to assume that every body-facing surface has no convective gap or that all heat must enter the skin.

The F2 LED Face Mask can be used as a product example only when its actual construction drawings, rated input, temperature-rise report, and model-specific certificates are available. CE-EMC, CE-LVD, and RoHS documentation can support market compliance, but the marks alone do not prove that a particular copper layout or passive heat-spreading architecture passed a specific test. For equipment operating below 50V AC or 75V DC, the Low Voltage Directive may not apply directly to the mask body even when the mains adapter falls within its voltage scope.

When passive spreading reaches its limits

Passive cooling becomes inadequate when the heat generated per available dissipation area causes junction, component, or accessible-surface temperatures to exceed the design target.

The relevant variables include:

• actual electrical input and optical output;
• LED spacing and current density;
• thermal conductivity and thickness of the PCB stack;
• copper coverage and thermal-via design;
• contact resistance at interfaces;
• housing surface area and emissivity;
• ambient temperature and airflow;
• session length and duty cycle.

A dense cluster of undercooled LEDs can create a hot spot even when total device power is modest. Conversely, a larger product with a conductive housing and sufficient surface area may operate passively at a higher total input. Total wattage alone does not determine the answer.

Wearable thermal design and skin-contact safety

For a wearable device, user-contact temperature must be measured under defined worst-case conditions, including maximum intensity, highest rated ambient temperature, expected fit, longest allowed session, and foreseeable obstruction of the outer surface.

Useful evidence includes:

• a multi-point surface-temperature map;
• defined warm-up and measurement time;
• ambient temperature and humidity;
• temperature-sensor accuracy;
• automatic timeout or thermal cutoff behavior;
• test results under the applicable product-safety standard.

RoHS compliance is a hazardous-substance requirement, not evidence of cooling performance. Many high-conductivity thermal interface materials are available in RoHS-compliant formulations. A manufacturer should therefore verify both material compliance and thermal performance without implying that RoHS itself validates the heat path.

Why many full-body panels use heat sinks and active airflow

Annotated rear view of full-body red light panel showing aluminum fin array fan placement and airflow

Conceptual illustration only. It should not be treated as an exact representation of any RDPRO model unless verified against the production drawing.

Large full-body panels may contain hundreds or thousands of LED packages, several power supplies, control electronics, and a compact metal enclosure. When measured electrical input is high, fan-assisted airflow can reduce the size and temperature required of the passive metal structure.

This does not mean that the presence of fans proves poor efficiency. It also does not mean every panel above an arbitrary wattage must use a fan. The engineering question is whether the complete thermal system maintains its specified temperatures and optical output under the rated operating condition.

For current REDDOT examples:

• RDPRO3000-FS7 lists 600 dual-chip LEDs, 939W power consumption, eight cooling fans, and 115 mW/cm² at 15 cm.
• RDPRO6000-FS7 lists 1,200 dual-chip LEDs, 1,864W power consumption, fourteen cooling fans, and 124 mW/cm² at 15 cm.

These measured or declared device-level power figures—not the 5W package rating multiplied by LED count—are the appropriate starting points for a thermal budget. The waste heat still cannot be calculated accurately without optical output and power-conversion data.

Heat-sink design is a complete thermal-resistance problem

The junction-to-ambient path can include:

• junction-to-package or junction-to-solder thermal resistance;
• solder and PCB spreading resistance;
• PCB-to-chassis or PCB-to-heat-sink interface resistance;
• heat-sink spreading resistance;
• heat-sink-to-air resistance.

Improving only one link may have little effect if another interface dominates. For example, a large external heat sink cannot compensate for poor thermal-pad contact beneath the LED board.

Aluminum is commonly used because it combines useful thermal conductivity, low mass, manufacturability, and cost. However, the often-quoted value of approximately 205 W/m·K relates to particular aluminum conditions; the conductivity of an actual alloy, extrusion, coating, and assembly may differ. Product calculations should use the material value for the specified alloy and temperature.

Irradiance must be measured after thermal stabilization

A statement such as "124 mW/cm² at 15 cm" does not demonstrate that the entire 180 × 60 cm panel produces that value uniformly. It may be a center or peak reading.

A credible thermal and optical verification report should state:

• warm-up time before measurement;
• ambient temperature;
• operating mode and channel intensity;
• measurement distance and geometry;
• instrument model and spectral response;
• center, edge, and corner readings;
• grid-average irradiance and uniformity;
• repeatability and measurement uncertainty.

This separates short-term cold-start performance from the output users receive after the panel reaches a steady operating temperature.

Maximum junction temperature is not the design target

Many LED packages publish an absolute maximum junction temperature, often in a range such as 125–150°C. That figure is a limit, not a recommended continuous operating target. The design target should be set lower using the LED manufacturer's current-derating data, reliability goals, ambient-temperature range, and expected lifetime.

Premature output loss is not caused by the LED junction alone. Drivers, capacitors, connectors, solder joints, lenses, encapsulants, fans, and power supplies can also determine system lifetime. A credible reliability discussion should address the whole device rather than calling junction temperature the sole failure mechanism.

Fan noise, fan failure, and EMC

Fans introduce moving parts, acoustic noise, dust accumulation, and a possible failure mode. A robust design may include:

• fan-speed monitoring;
• temperature sensing;
• automatic current reduction;
• overtemperature shutdown;
• replaceable fan assemblies;
• defined cleaning and maintenance instructions.

Fan motors and controllers can contribute electromagnetic emissions, but they are only one source. LED drivers, switching power supplies, displays, wireless modules, and pulse-control electronics also affect EMC. A CE-EMC test supports complete-apparatus electromagnetic conformity under stated test modes; it does not, by itself, prove the reliability of the cooling system or every app, timer, and pulse function.

COB vs. discrete LED arrays

COB LED module versus discrete multi-LED array side-by-side thermal comparison at equal wattage

Conceptual illustration only. A COB contains multiple dies, and both COB and discrete arrays may require metal-core boards, copper spreading, thermal vias, or other heat-spreading structures.

A COB module places multiple LED dies close together on a common substrate. Compared with a discrete array spread over a larger PCB, this can create a higher local heat flux. That concentration may require a low-resistance interface, a larger mounting base, or more deliberate spreading before heat reaches the final heat sink.

However, the thermal load is not equal to the COB's nominal electrical rating. It is the actual input minus optical power leaving the package. A "180W COB" may also be operated below its nominal maximum, so the finished-device input and stabilized temperature must be measured.

A discrete array distributes packages across a wider area, which can reduce local heat flux. It does not eliminate the need for thermal engineering. Each package still transfers heat through solder, PCB materials, copper, thermal vias, a metal core, or a chassis. Whether copper spreading is required depends on board construction, LED pitch, current, and allowable temperature.

Failure behavior also depends on circuit topology:

• an open discrete LED may disable an entire series string;
• parallel circuits may allow part of an array to remain active;
• a COB may contain several internal strings, so one die or string failure does not always disable the complete module;
• either architecture can fail because of its driver or thermal interface rather than the emitters.

COB output does not inherently shift wavelength or decline faster than discrete LED output. At the same junction temperature and current density, the semiconductor material and package construction govern the optical response. The correct comparison is therefore based on measured junction or case temperature, radiant output, spectrum, and thermal resistance—not the package label alone.

If the RDX2 Therapy Lamp is described as using a 180W COB and delivering 124 mW/cm² at 6 inches, the associated specification should clarify:

• whether 180W is nominal LED capacity or measured device input;
• the actual power consumption;
• the stabilized irradiance after warm-up;
• the measurement point and instrument;
• the COB mounting and thermal interface;
• temperature under the longest rated session.

Sealed enclosures and thermal trade-offs

The device is designed for sauna environments, featuring a moisture-resistant and sealed enclosure.

Conceptual illustration only. IP65 alone does not establish suitability for every sauna temperature, steam, condensation, or installation condition.

IP65 is an ingress-protection rating. It addresses enclosure protection against dust and water jets under defined test conditions. It does not automatically prove resistance to continuous high temperature, steam, condensation, corrosion, thermal cycling, or a specific sauna electrical-installation requirement.

A sealed enclosure restricts direct air exchange with the room, but it does not eliminate convection. Air may still circulate inside the housing, and the outer surface still loses heat through external convection and thermal radiation. Heat may also conduct through mounting brackets or adjacent structures.

For a product such as SAUNAONE, the relevant evidence should include:

• the exact model's IP test report;
• rated ambient-temperature and humidity range;
• whether condensation is permitted;
• actual electrical input and session duty cycle;
• stabilized internal-component and accessible-surface temperatures;
• installation clearances and mounting orientation;
• the applicable electrical and product-safety standard;
• corrosion and material compatibility for the intended environment.

IEC 60598-1 may be relevant only if the product is classified and assessed as a luminaire. A phototherapy or skin-exposure product may require a different product standard based on its intended use. The report scope and model identification must be checked instead of assuming one standard covers every LED device.

Engineering options for sealed products

Possible design approaches include:

• a thermally conductive metal enclosure;
• bonded metal-core PCB construction;
• low-resistance thermal interface materials;
• external fins or mounting structures;
• thermally conductive potting compounds;
• duty-cycle limits or temperature-based current reduction;
• high-emissivity surface finishes;
• phase-change materials for short-duration heat buffering.

These are design options, not confirmed SAUNAONE features unless supported by drawings and test records. High-emissivity coatings may improve radiative heat transfer, but the benefit decreases as the temperature of surrounding surfaces approaches the enclosure temperature. In a hot sauna, this must be calculated rather than presented as a free or unlimited cooling gain.

Before selecting a sealed phototherapy device for a high-humidity installation, ask:

1. What exact ambient temperature, humidity, steam, and condensation conditions are permitted?
2. What is the actual input power in the intended operating mode?
3. What are the stabilized internal and accessible-surface temperatures at the maximum rated ambient?
4. Which safety standard and installation conditions were included in the report?
5. What happens if heat dissipation is obstructed or the session is repeated without full cooldown?

What verified thermal management looks like in production

Production floor quality inspection station with thermal testing equipment and checklist

Thermal verification requires both design evidence and production controls. Different documents prove different things:

• IEC 62471 report: optical-radiation hazard assessment for the tested configuration.
• Electrical safety report or listing: compliance with the named product standard and tested model.
• CE or UKCA documentation: the manufacturer's declaration of conformity with applicable legislation; third-party involvement depends on the regulatory route.
• ETL Listing: product compliance with the named North American safety standard, normally supported by follow-up factory inspections.
• SAA approval or RCM evidence: Australian or New Zealand market evidence for the exact product and applicable scheme.
• ISO 13485 certificate: an audited quality management system within the stated scope.
• MDSAP certificate: evidence of a regulatory quality-system audit covering applicable requirements of participating jurisdictions.

None of these documents automatically proves that every production unit receives a complete irradiance map or thermal soak test. ISO 13485 requires controlled and documented processes, but the manufacturer must define specific inspection items, sampling plans, acceptance criteria, and records based on product requirements and risk.

If REDDOT uses a 37-step inspection process, that statement should be supported by the current controlled procedure. Relevant thermal and optical checkpoints may include:

• incoming LED bin and supplier-lot verification;
• solder and thermal-pad inspection;
• PCB and interface-material assembly checks;
• electrical input and current measurement;
• warm-up or burn-in under a defined mode;
• stabilized irradiance measurement;
• surface-temperature or thermal-camera inspection;
• fan operation and airflow check where applicable;
• overtemperature protection verification;
• final traceability record linked to model, serial number, and design revision.

Forward voltage can provide useful information only when current and temperature are controlled. Because forward voltage itself changes with junction temperature, it is not a standalone diagnosis of LED condition or solder quality. It should be combined with optical output, electrical resistance, visual inspection, and thermal measurements.

How to review a third-party report

Ask for:

1. the full report or certificate rather than a cropped logo;
2. the exact model and hardware configuration;
3. issuing laboratory or certification body;
4. applicable standard and edition;
5. report date and current validity;
6. accreditation scope for the relevant test method;
7. production-site and model coverage;
8. any deviations, conditions, or limitations.

Intertek is a testing and certification organization. SAA Approvals is a certification body rather than a test laboratory or national accreditation body. National accreditation bodies include organizations such as UKAS, CNAS, NATA, and others depending on jurisdiction. Verification should distinguish the manufacturer, test laboratory, certification body, regulatory authority, and accreditation body.

CE conformity should be checked through the EU Declaration of Conformity, model identification, applicable directives or regulations, standards, technical documentation, and manufacturer signature. A voluntary "CE certificate" is not a substitute for the legally required conformity assessment.

IEC 62471 testing does not assume or certify a therapeutic dose. If thermal drift materially changes optical output, the manufacturer should reassess performance and, where relevant, confirm that the tested worst-case optical emission still represents the production device. A drop in treatment irradiance is a performance-consistency issue; it is not automatically a photobiological safety failure.

What to verify before purchasing or distributing a device

Cross-referencing actual input power against size, mass, materials, airflow, and stabilized temperature is more meaningful than comparing nominal LED wattage. A silent panel is not automatically defective: its chassis may be designed as a passive heat sink, and the LEDs may be intentionally driven below their maximum rating to improve efficiency and longevity. The correct conclusion comes from measurements.

Key Takeaways

Wearables commonly use passive heat spreading because they usually operate at lower total power and must remain thin, quiet, flexible, and comfortable near skin. Full-body panels often combine metal spreading structures with fans because their measured input and total heat load are higher within a constrained enclosure.

These are typical design choices, not universal laws. A credible thermal evaluation should use:

• actual electrical input rather than nominal LED wattage;
• optical power or irradiance rather than lumens for near-infrared output;
• junction, case, and surface temperatures after stabilization;
• a complete junction-to-ambient thermal-resistance analysis;
• model-specific safety reports and conformity documents;
• defined production inspection and traceability records.

The most useful buyer question is not "Does it have a fan?" It is:

Under the maximum rated operating condition, what measured data show that the device maintains safe temperatures and stable optical output?

FAQ

What is the difference between active and passive heat sinks?

A passive heat sink uses conduction, natural convection, and thermal radiation without powered airflow. An active heat sink adds a fan, pump, or another powered mechanism to increase heat transfer.

Active cooling can reduce the heat-sink size or temperature required for a given thermal load, but it introduces noise, maintenance, and another possible failure mode. Passive cooling can be reliable and quiet, but it may require more metal surface area, a higher enclosure temperature, or lower LED drive.

Must every high-power phototherapy panel use fans?

No universal wattage threshold determines this. Compact panels with high measured input often benefit from fans, but a passive design may be viable when it has sufficient conductive material, surface area, allowable temperature rise, and verified thermal performance. The decision should be based on the thermal-resistance budget and test data.

What is the main obstacle to using passive heat sinks?

The main constraint is achieving sufficiently low thermal resistance within the available size, mass, orientation, surface-temperature, and ambient-temperature limits. Size is often important, but it is not the only factor. Fin spacing, airflow path, heat spreading, mounting, surface temperature, and duty cycle also matter.

Can body heat be converted to electricity?

Yes. Thermoelectric generators use the Seebeck effect to convert a temperature difference into electrical voltage. They can operate with only a few degrees of temperature difference, but the available power density is usually low when the source is human skin. That may be sufficient for some sensors or low-power electronics, but not for powering a typical phototherapy LED array.

What is the purpose of a heat sink?

A heat sink provides a lower-resistance path from a heat-generating component to the surrounding environment. In an LED system, the complete path starts at the junction and continues through the package, board, interface, and heat sink or chassis.

High junction temperature can reduce radiant output and accelerate degradation. However, LEDs do not always "throttle" automatically; output reduction or shutdown occurs only if the driver includes temperature-based control. Without such protection, excessive temperature may cause accelerated aging or sudden component failure.

Is a cool outer housing proof of good thermal management?

No. A cool housing may mean low input power, effective cooling, poor thermal coupling from the LED board, or a measurement taken before stabilization. A warm metal housing can sometimes indicate that heat is being transferred away from internal components effectively. Internal or estimated junction temperature, stabilized optical output, and a defined thermal test are more informative than touch alone.

Related Guides

Related guides on LED therapy thermal management and device types

Wearable and full-body phototherapy devices use different combinations of the same heat-transfer mechanisms. The relevant distinction is not simply "mask versus panel," but the interaction of actual input power, heat flux, surface area, materials, operating environment, and allowable temperature.

Engineering and application guides in this cluster:

• LED junction temperature and wavelength stability — separating reversible thermal shift from permanent aging.
• Wearable thermal substrate design — flexible PCB copper, encapsulation, fit, and contact-temperature mapping.
• Heat-sink selection for high-output panels — thermal resistance, fin geometry, fans, and fan-failure protection.
• Thermal and photobiological safety — distinguishing IEC 62471 from electrical and surface-temperature requirements.
• OEM/ODM thermal specification checklist — the measurements and documents to request before mass production.

References

1. International Electrotechnical Commission. IEC 62471:2006, Photobiological Safety of Lamps and Lamp Systems.
   https://webstore.iec.ch/en/publication/7076

2. International Electrotechnical Commission. IEC 60335-2-27:2024, Particular Requirements for Appliances for Skin Exposure to Optical Radiation.
   https://webstore.iec.ch/en/publication/70389

3. International Electrotechnical Commission. IEC 60601-2-57:2023, Particular Requirements for Non-Laser Light Source Equipment Intended for Therapeutic, Diagnostic, Monitoring, Cosmetic and Aesthetic Use.
   https://webstore.iec.ch/en/publication/73147

4. International Electrotechnical Commission. IEC 60529, Degrees of Protection Provided by Enclosures (IP Code).
   https://webstore.iec.ch/en/publication/2452

5. International Electrotechnical Commission. IEC 60598-1:2024, Luminaires—General Requirements and Tests.
   https://webstore.iec.ch/en/publication/66620

6. International Organization for Standardization. ISO 13485:2016, Medical Devices—Quality Management Systems—Requirements for Regulatory Purposes.
   https://www.iso.org/standard/59752.html

7. European Commission. Low Voltage Directive 2014/35/EU.
   https://single-market-economy.ec.europa.eu/sectors/electrical-and-electronic-engineering-industries-eei/low-voltage-directive-lvd_en

8. European Commission. CE Marking.
   https://single-market-economy.ec.europa.eu/single-market/goods/ce-marking_en

9. European Commission. RoHS Directive.
   https://environment.ec.europa.eu/topics/waste-and-recycling/rohs-directive_en

10. U.S. Food and Drug Administration. Medical Device Single Audit Program.
    https://www.fda.gov/medical-devices/cdrh-international-affairs/medical-device-single-audit-program-mdsap

11. Cree LED. Thermal Management of XLamp LEDs.
    https://assets.cree-led.com/a/da/x/XLamp-Thermal-Management.pdf

12. U.S. Department of Energy. Luminous Flux and Chromaticity Maintenance for Select High-Power Color LEDs.
    https://www.energy.gov/documents/sslrtilm80-color-ledsjuly2018pdf

13. U.S. Department of Energy. Solid-State Lighting R&D Opportunities.
    https://www.energy.gov/sites/default/files/2022-02/2022-ssl-rd-opportunities.pdf

14. Intertek. ETL Listed Mark and Follow-Up Services.
    https://www.intertek.com/product-certification-marks/etl/

15. REDDOT LED. RDPRO3000-FS7 Product Specifications.
    https://www.reddotled.com/rdpro3000-fs7-panel-the-new-standard-in-professional-wellness.html

16. REDDOT LED. RDPRO6000-FS7 Product Specifications.
    https://www.reddotled.com/rdpro6000-fs7-panel-where-human-potential-is-redefined.html